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PRESIDENT
Xiande Zhao: The Chinese University of Hong Kong, xiande@baf.msmail.cuhk.edu.hk
VICE PRESIDENTS
Waiman Cheung: The Chinese University of Hong Kong,
waiman@baf.msmail.cuhk.edu.hk
Kwang Hyung Lee: KAIST,
Korea, khlee@if.kaist.ac.kr
Baoding Liu: Tsinghua
University, China, liu@tsinghua.edu.cn
Hung T. Nguyen: New Mexico State University, USA, hunguyen@nmsu.edu
Jerry Wei: University of Notre Dame, USA, jwei@nd.edu
SECRETARY GENERAL
Waiman Cheung: The Chinese University of Hong Kong,
waiman@baf.msmail.cuhk.edu.hk
EXECUTIVE COMMITTEE
Waiman Cheung(HK), The Chinese University of Hong
Kong, waiman@baf.msmail.cuhk.edu.hk
Russell Ching(USA), California State University, chingr@csus.edu
Augustine O. Esogbue (USA), Georgia Institute of Technologe, aesogbue@isye.gatech.edu
Mitsuo Gen (Japan), Waseda
University, gen@waseda.jp
Vincent Lai (HK), The Chinese University of Hong Kong, sklai@baf.msmail.cuhk.edu.hk
E. Stanley Lee (USA), Kansas State University, eslee@ksu.edu
Kwang Hyung Lee (Korea),
KAIST, khlee@if.kaist.ac.kr
Baoding Liu (China), Tsinghua University,
liu@tsinghua.edu.cn
M.K. Luhandjula (South Africa), University of South
Africa, Luhanmk@unisa.ac.za
Guorui Miao (China),
Northwest Power Construction Company,
Hung T. Nguyen (USA), New Mexico State University, hunguyen@nmsu.edu
Jerry Wei (USA), University of Notre Dame, jwei@nd.edu
Xiande Zhao: The Chinese University of Hong Kong, xiande@baf.msmail.cuhk.edu.hk
BOARD MEMBERS (including members of executive
committee)
Tung-Shou Chen(Taiwan), National Taichung Institute of Technology, tschen@ntit.edu.tw
Waiman Cheung (HK), The Chinese University of Hong
Kong, waiman@baf.msmail.cuhk.edu.hk
Russell Ching (USA), California State University, chingr@csus.edu
Tommy Lee Coleman (USA), Alabama A&M university, Tommy.Coleman@email.aamu.edu
Giulianella Coletti
(Italy), University of Perugia, coletti@dipmat.unipg.it
Hepu Deng (Austrilia),
RMIT University, hepu.deng@rmit.edu.au
Wlodzislaw Duch (Poland),
Nicholaus Copernicus University, wduch@phys.uni.torun.pl
Augustine O. Esogbue (USA), Georgia Institute of Technologe, aesogbue@isye.gatech.edu
Mitsuo Gen (Japan), Waseda
University, gen@waseda.jp
Chih-Cheng Hung (USA), Southern Polytechnic State
University, chung@spsu.edu
Tak Kee Hui (Singapore), NUS Business School, bizhuitk@nus.edu.sg
Hark Hwang (Korea), KAIST, harkhwang@kaist.ac.kr
Heung Suk Hwang (Korea), TongMyong University, hshwang@tu.ac.kr
Kakuzo Iwamura (Japan), Josai University, kiwamura@math.josai.ac.jp
Heikki Karjaluoto
(Finland), University of Oulu, heikki.karjaluoto@oulu.fi
Wonkyung Kim (Korea), Kyungnam
University, wkkim@kyungnam.ac.kr
Vincent Lai (HK), The Chinese University of Hong Kong, sklai@baf.msmail.cuhk.edu.hk
Kokin Lam (HK), City University of Hong Kong, cmkklam@cityu.edu.hk
Ronald Lau (HK), Hong Kong University of Science and Technologe,
rlau@ust.hk
Claude Langrand (France), University Des Sciences
Et Technologies De Lille, Claude.Langrand@univ-lille1.fr
E. Stanley Lee (USA), Kansas State University, eslee@ksu.edu
Kwang Hyung Lee (Korea),
KAIST, khlee@if.kaist.ac.kr
Baoding Liu (China),
Tsinghua University, liu@tsinghua.edu.cn
Linzhong Liu (China),
Lanzhou Jiaotong
University, lzliu@orsc.edu.cn
Yan-Kui Liu(China), Hebei University, yliu@hbu.edu.cn
M.K. Luhandjula (South Africa), University of South
Africa, Luhanmk@unisa.ac.za
Guorui Miao (China),
Northwest Power Construction Company, gmiao@orsc.edu.cn
Man Kwong Mok (HK), The
Chinese University of Hong Kong, mankwongmok@cuhk.edu.hk
Hung T. Nguyen
(USA), New Mexico State University, hunguyen@nmsu.edu
Jin Peng (China), Huang'gang Normal University, pengjin01@tsinghua.org.cn
Pawel Radzikowski
(Poland), PawelR@aol.com
Romano Scozzafava (Italy), University of La Sapienza, romscozz@dmmm.uniroma1.it
Jerry Wei (USA), University of Notre Dame, jwei@nd.edu
Kang Yen (USA), Florida International University, yenk@fiu.edu
Gengui Zhou (China), Zhejiang
University of Technology, ggzhou@zjut.edu.cn
Yuanguo Zhu (China),
Nanjing University of Science and Technology, ygzhu@mail.njust.edu.cn
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